What are the factors that affect the performance of thermal conductive adhesives
The thermal conductivity of the filled adhesive mainly depends on the resin matrix, the thermally conductive filler and the interface formed by the two. The type, amount, particle size, geometry, mixed filling and surface modification of the thermally conductive filler will all affect the thermal conductivity of the adhesive. Performance has an impact.
Analysis of the application scope of thermal conductive glue
Thermally conductive adhesives are widely used in LEDs, microprocessors, memory modules, high-speed buffers, sealed integrated chips, DC/DC converters, IGBTs and other power modules, power semiconductors, solid state relays and bridge rectifiers.
What are the factors that affect the performance of thermal conductive adhesives
The thermal conductivity of the filled adhesive mainly depends on the resin matrix, the thermally conductive filler and the interface formed by the two. The type, amount, particle size, geometry, mixed filling and surface modification of the thermally conductive filler will all affect the thermal conductivity of the adhesive. Performance has an impact.
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