Thermally conductive adhesives are widely used in LEDs, microprocessors, memory modules, high-speed buffers, sealed integrated chips, DC/DC converters, IGBTs and other power modules, power semiconductors, solid state relays and bridge rectifiers.

The thermal conductive glue has a certain degree of adhesion, and it will not dry out. It can be attached to the higher temperature devices in the power supply or power equipment to transfer the heat. One of the typical applications is the application of driving power in LED bulb lamps. In order to pass the UL certification in the exported LED lights, manufacturers often use two-component potting glue for potting. Lamps exported to the United States require a 50,000-hour warranty. The quality of the current LED lamp beads is no problem. The main fault is the power supply. The power supply after potting with potting glue cannot be disassembled and can only be repaired. The lamp shall be scrapped and replaced. If the power supply is partially filled with thermal conductive mud, the heat can be effectively exported. If there is a problem with the power supply, the power supply can be easily replaced to save costs for the enterprise. Of course, for lights that require waterproofing. Because thermal conductive mud cannot fill all gaps and gaps like potting glue, and cannot be waterproof and moisture-proof, potting glue is still needed.

Another typical application is in the LED fluorescent tube. For the design of the power supply at both ends, in order not to occupy too much of the size of the tube, the space of the power supply at both ends is relatively small, and the power of the 1.2m LED fluorescent tube is usually designed to 18w to 20w, so the heat generated by the driving power supply becomes larger. The thermal conductive mud can be filled into the gap of the power supply, especially attached to the power device to help dissipate heat and extend the life of the lamp tube. For some sealed modular power supplies, thermally conductive mud can be partially filled to achieve the effect of heat conduction.