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Products Name

Nano carbon copper

Summary information
Products Number
没有此类产品
Product description

◆ Product introduction:

DY88 series belongs to nano-carbon copper foil tape. It is a nano-treated copper foil substrate, coated with a heat-radiating low-acid heat-sensitive adhesive layer on one side, and coated with a nano-thermal conductive material coating on one side. The Uniform heat dissipation performance is better than that of artificial graphite sheet.

 

◆ Components:


◆ Category:

● DY88**01:External thermal conductive insulating nano carbon copper foil coated with thermal conductive non-conductive adhesive

● DY88**02:External thermal conductive insulating nano carbon copper foil coated with heat conductive and conductive adhesive

● DY88**03:External thermal conductive insulating nano carbon copper foil coated with thermal non-conductive adhesive

● DY88**04:External thermal conductive insulating nano carbon copper foil coated with heat conductive and conductive adhesive



◆ Advantage:

● Reliable performance in high and low temperature environments:Good adhesion performance in high and low temperature environments, especially in the case of long-term high temperature heating, the bonding is not easy to slip.

● Excellent self-heating performance: The surface is coated with carbon nanotube coating through special dispersing technology, high thermal conductivity, high radiation heat dissipation, and self-heating even in a closed environment.

● Flexible substrate selection: Most products offer dual choice of domestic and imported substrates, allowing users to choose affordable products for different applications.

 

 Application:

lConnection conduction:Connection of internal structural parts of electronic devices such as mobile phones, tablets, computers, etc.

lSignal shielding:Signal shielding for electronic devices with communication functions such as mobile phones, computers, navigators

lAnti-EMIAnti-signal interference of mobile devices such as mobile phones, televisions, and electronic devices such as printers and scanners

lHeat conduction and heat dissipation: Heat conduction and heat dissipation required for all electronic and electrical equipment such as mobile phones, computers, and televisions

 

          

 

◆ Product properties:

Part

Thicknessmm)

Adhesive force(gf/25mm)

Resistivity

(Ω/inch2)

 Shielding effectiveness

dB(10MHz-3GHz)

Heat resistance

(℃)

DY88**01

0.03~0.5

≥800

Outer insulation thermal conductive coating + insulating thermal adhesive

Outer layer

Non-conductive

 >60

一10℃~150℃

Glue layer

Non-conductive

DY88**02

0.03~0.5

≥800

Outer insulation thermal conductive coating + conductive thermal adhesive

Outer layer

Non-condcutive

  >60

一10℃~150℃

Glue layer

≤0.05

DY88**03

0.03~0.5

≥800

External conductive thermal coating + insulating thermal adhesive

Outer layer

≤0.05

   >60

一10℃~150℃

Glue layer

Non-conductive

DY88**04

0.03~0.5

≥800

External conductive coating + conductive thermal adhesive

Outer layer

≤0.05

   >60

一10℃~150℃

Glue layer

≤0.05


Remarks:DY88**01 and DY88**02 are conventional materials, generally having thicknesses of 0.03mm, 0.05mm, 0.07mm, 0.1mm, 0.12mm, and 0.15mm. DY88**03 and DY88**04 need to be ordered.

Outer laye

Outer laye

 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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