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Graphene heat dissipation film

DY9 series is a graphene heat dissipation film, which is made of high-temperature resistant PET or PI as the base material. High-purity graphene slurry is deposited on the surface through a special process and laminated at high temperature.
Product Details

◆ Product introduction The
DY9 series is a graphene heat dissipation film, which is made of high-temperature resistant PET or PI as the base material. High-purity graphene slurry is deposited on the surface through a special process and laminated at high temperature. The graphene heat dissipation film produced by our company can be separated from the carrier and formed into a film separately. It has the advantages of high thermal conductivity, controllable thickness, etc., and has a very wide range of applications. It is a high-end thermal and heat dissipation material that is very popular in the 5G era.
 

◆Constitution

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◆ Category
● DY90**: Graphene film
● DY91**: Graphene film with adhesive on one side
● DY91**DC: Graphene film with adhesive on both sides
● DY90**-N: Graphene film without substrate


◆ Advantages
● High purity: The thickness of graphene flakes is controlled within 5 layers, which has high purity.
● High density: After the graphene film is prepared, it undergoes precise pressure bonding to ensure the high density of the graphene film, so as to have a better heat conduction and heat dissipation effect.

 

◆ Purposes
● Signal shielding: signal shielding for mobile phones, computers, navigators and other electronic equipment with communication functions
● Anti-electromagnetic interference: anti- signal interference for mobile phones, televisions and other communication equipment as well as printers, scanners and other electronic equipment
● Heat conduction and heat dissipation: mobile phones, Computers, TVs and other electronic and electrical equipment need to conduct heat and heat dissipation

 

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Mobile phone cooling application Mobile phone cooling application Three-dimensional graphene Graphene film preparation

 

◆ Characteristic table

model

Thickness (mm)

Thermal conductivity (W/mK)

   Shielding effectiveness dB (10MHz-3GHz)

Temperature resistance (℃)

DY90 **

0.01~0.5

≥1500

         >65

    -50℃~300℃

DY91 **

0.03~0.5

Outer layer

≥1500

          >65

一20℃~150℃

Glue layer

≥20

DY91**DC

0.03~0.5

Glue layer

≥20

          >65

一20℃~150℃

Glue layer

≥20

DY90**-N

0.03~0.5

≥1500

          >65

 -50℃~300℃

 

 

 

 

 

☆Remarks: The above materials are all specially customized materials. If necessary, please contact the sales staff.
☆The above data is only part of the performance description of the product. If you need to know the details, please contact the relevant personnel of our company to obtain TDS, MSDS and related environmental protection materials SGS .

0769-85305921

Online Time:09:30-05:30

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Dongguan Dongyan Electronic Material Technology Co., Ltd.

Address: Building H, No. 93, Daxin Road, Dazhou Community, Qiaotou Town, Dongguan City
E-mail:
dongyan_tech@126.com
Fax:0769-82283852
Tel:
0769-85305921

COPYRIGHT © 2021 Dongguan Dongyan Electronic Material Technology Co., Ltd. ALL right SERVER  

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