Special plating layer copper foil
◆ Product introduction
DY5 series is a special electroplated copper foil, which is electroplated on the surface of copper foil (phosphor bronze, titanium copper, brass, pure copper, etc.) with a certain thickness of other metal layers such as gold, silver, tin, nickel, graphene, etc. , So as to achieve better electrification performance, such as high conductivity, corrosion resistance, oxidation resistance, solderability, high shielding, wave absorption and other special functions. Our company produces special electroplated copper foil to better serve the needs of various high-end electronic products in the 5G era.
◆ Composition
◆ Category
● DY50**-DG: gold-plated copper foil
● DY52**-DG: gold-plated copper foil tape: single-sided composite high-conductivity adhesive with gold-plated copper foil on both sides
● DY50**-DN: nickel-plated copper foil
● DY52 **-DN: Nickel-plated copper foil tape: single-sided composite high-conductivity adhesive on nickel-plated copper foil
● DY50**-DT: tinned copper foil
● DY52**-DT: tinned copper foil tape: tinned Single-sided composite high-conductivity adhesive for copper foil
◆ Advantages
● Reliable high and low temperature performance: good bonding stability performance in high and low temperature environments, especially in the case of long-term high temperature heating, the bonding is firm and not easy to slip off.
● The electroplating layer is thick, and the purity of the plating layer is extremely high, and the product can pass the salt spray test.
● Excellent solderability, and some products support low-temperature soldering.
◆ Purposes
● Connection conduction: connection conduction of internal structural parts of electronic devices such as mobile phones, tablets, computers
● Signal shielding: signal shielding of electronic devices with communication functions such as mobile phones, computers, navigators, etc.
● Anti-electromagnetic interference: mobile phones, TVs and other communications equipment as well as printers, scanners and other electronic equipment anti-signal interference
● thermal cooling: cell phones, computers, televisions and other electrical and electronic equipment all require thermal conductivity and heat dissipation
Signal amplification | mobile application |
◆Characteristics table
model | Thickness (mm) | Viscosity (gf/25mm) | Resistance (Ω/inch2) |
Shielding effectiveness dB (10MHz-3GHz) |
||
DY50**-DG | 0.01~0.2 | / | Gold-plated layer | ≤0.005 | >75 | |
DY52**-DG | 0.012~0.22 | ≥1200 | Single side with conductive adhesive | Gold-plated layer | ≤0.005 | >75 |
Glue layer | ≤0.05 | |||||
DY50 ** - DN | 0.01~0.2 | / | Nickel plating | ≤0.005 | >75 | |
DY52**-DN | 0.012~0.22 | ≥1200 | Single side with conductive adhesive | Nickel plating | ≤0.03 | >75 |
Glue layer | ≤0.05 | |||||
DY50**-DT | 0.03~0.2 | / | Tinned layer | ≤0.1 | >75 | |
DY52**-DT | 0.012~0.22 | ≥1200 | Single side with conductive adhesive | Tinned layer | ≤0.1 | >75 |
Glue layer | ≤0.05 |
☆Remarks: Only a small part of the thickness of the above materials are available in stock, and most of them require special customization.
☆The above data is only part of the performance description of the product. If you need to know the details, please contact the relevant personnel of our company to obtain TDS, MSDS and related environmental protection materials SGS
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