◆ Product introduction
DY20** series is a non-substrate thermally conductive adhesive tape. It is made by directly coating release paper or release film with our self-developed high thermal conductivity acrylic glue and baking it in an oven.
 

◆ Composition

◆ Category
● DY20**: release paper without substrate thermal conductive adhesive: directly apply conductive acrylic adhesive on the release paper
● DY20**M: release film without substrate thermal conductive adhesive: directly apply on the release film Conductive acrylic adhesive
 

◆ Advantages
● More reliable adhesion: not only the flat surface anti-uplifting is guaranteed, but the curved surface anti-upwarding performance is also very good.
● Good thermal conductivity: traditional thermal conductive adhesives generally use a simple formula of alumina to achieve a certain thermal conductivity, and the thermal conductivity is not ideal, but the thermal conductivity formula developed by our company can achieve better thermal conductivity

◆ Uses
● Special material compounding: suitable for compounding with various thermal conductive materials such as copper foil, aluminum foil, thermal silica gel, graphene materials, nanocomposite materials
● gap filling heat conduction: suitable for filling gaps in the structure of various electronic products that require thermal conductivity.

◆Characteristics table

☆Remarks: Non-substrate thermally conductive adhesive film (with release paper) DY20** is in stock, and the conventional thickness is 0.01mm, 0.015mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.1mm, 0.2mm. Non-substrate thermal conductive adhesive film (with release film) DY20**M is an unconventional material, and it needs to be communicated and prepared in advance.
☆The above data is only part of the performance description of the product. If you need to know the details, please contact the relevant personnel of our company to obtain TDS, MSDS and related environmental protection materials SGS.